DIP Packaging Bus
SINGULAR COMMITMENT TO THE HIGHEST STANDARDS IN ENGINEERING, QUALITY CONTROL, AND MANUFACTURING

DIP Packaging Bus
 
This DIP Packaging Bus is designed to fit under IC's to save space and to allow for a free flow of air across the board. If you can use the Atlee Standard DIP Bus, you can specify length, number of tabs, their spacing, and number of conductors. If not, let Atlee customize to your specifications.
 
Notes
  1. "P" from .100 up, in increments of .100 up to .300. Over .300, any spacing.
  2. "D" from zero up, in increments of .100
  3. "N" number of tabs on each layer@ equal spacing; cumulative tolerance less than +/- .005 in 10 inches.
  4. "L" = P X (N-1) + D + .20
  5. Conductors:  1/2 hard electrical grade copper, .012 thick per QQ-C-576A, Type 110.
  6. Standard finish:  .0003 - .0005 tin-lead electroplate per MIL-T-10727 Type 1.
  7. Insulation:  Capacity of greater than 100 pf/in2 and a dielectric of greater than 300 VDC, unless otherwise specified.
  8. Bus will withstand wave soldering temperatures to 500o F for a minimum of 6 seconds.
 
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