Back Up
Spring
Note:
.010 thick material is standard.
Dimension L tolerance is ±.02.
Dimension M tolerance is ±.005.
Part Number
L
± .02
M
± .005
A
± .02
B
± .005
CS0252
2.00
1.750
.12
.110
CS0253
2.50
2.250
.12
.110
CS0254
3.00
2.750
.12
.110
CS0255
3.50
3.250
.12
.110
CS0256
4.00
3.750
.12
.110
CS0257
4.50
4.250
.12
.110
CS0258
5.00
4.750
.12
.110
CS0259
5.50
5.250
.12
.110
CS0260
6.00
5.750
.12
.110
CS0261
3.50
3.050
.25
.098
Features
High retention of printed circuit board under severe shock and vibration.
Easily installed by welding or riveting.
Rigidly mounted printed circuit board in racks and other types of assemblies.
Government Specifications
Materials:
Stainless Steel (MIL-S-5059) or Beryllium Copper (QQ-C-533)
Plating:
Cadmium (QQ-P-416), Silver (QQ-S-365), Zinc (QQ-Z-325), Electroless Nickel (MIL-C-26074)
Finishes Available
Standard:
Beryllium Copper - Cadmium Chromate (Golden) and Stainless Steel - Passivate
Optional:
Electroless Nickel, Silver (Tarnish Resistant), Zinc
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